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RIS citation export for WEPLM47: Analysis of High Field Q-Slope (HFQS) Causes and Development of New Chemical Polishing Acid

AU  - Luo, D.
AU  - Metzgar, E.S.
AU  - Nakajima, T.
AU  - Nasu, I.
AU  - Popielarski, L.
AU  - Saito, K.
AU  - Shanab, S.M.
AU  - Simpson, G.V.
AU  - Taguchi, J.
ED  - Yamazaki, Yoshishige
ED  - Raubenheimer, Tor
ED  - McCausey, Amy
ED  - Schaa, Volker RW
TI  - Analysis of High Field Q-Slope (HFQS) Causes and Development of New Chemical Polishing Acid
J2  - Proc. of NAPAC2019, Lansing, MI, USA, 01-06 September 2019
CY  - Lansing, MI, USA
T2  - North American Particle Accelerator Conference
T3  - 4
LA  - english
AB  - In our previous studies of High Field Q-slope (HFQS) we have concluded that nitrogen contamination from the nitric acid is the main cause of the degradation of the Q in buffered chemical polished cavities. Our conclusion is made based on previously unresolved phenomena which are found from huge amount of published cavity test data, include fine grain, large grain and single crystal cavities treated with EP and BCP. According to this analysis, we have started developing new nitrogen-free chemical polishing acid. Hydrogen peroxide with HF mixture was reported able to react with Nb, and there’s no extra element contamination in it, so we replace the conventional BCP with this mixture to start our study. In this paper, some Nb coupon sample results with new acid will be reported. We complete the first step of developing the new acid and we got the Nb finish roughness no worse than conventional BCP.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 699
EP  - 702
KW  - cavity
KW  - experiment
KW  - superconductivity
KW  - niobium
DA  - 2019/10
PY  - 2019
SN  - 2673-7000
SN  - 978-3-95450-223-3
DO  - doi:10.18429/JACoW-NAPAC2019-WEPLM47
UR  - http://jacow.org/napac2019/papers/weplm47.pdf
ER  -