|WEPLM47||Analysis of High Field Q-Slope (HFQS) Causes and Development of New Chemical Polishing Acid||699|
|SUPLS04||use link to see paper's listing under its alternate paper code|
Funding: U.S. National Science Foundation under Grant PHY-1565546.
In our previous studies of High Field Q-slope (HFQS) we have concluded that nitrogen contamination from the nitric acid is the main cause of the degradation of the Q in buffered chemical polished cavities. Our conclusion is made based on previously unresolved phenomena which are found from huge amount of published cavity test data, include fine grain, large grain and single crystal cavities treated with EP and BCP. According to this analysis, we have started developing new nitrogen-free chemical polishing acid. Hydrogen peroxide with HF mixture was reported able to react with Nb, and there’s no extra element contamination in it, so we replace the conventional BCP with this mixture to start our study. In this paper, some Nb coupon sample results with new acid will be reported. We complete the first step of developing the new acid and we got the Nb finish roughness no worse than conventional BCP.
|DOI •||reference for this paper ※ https://doi.org/10.18429/JACoW-NAPAC2019-WEPLM47|
|About •||paper received ※ 13 September 2019 paper accepted ※ 04 December 2019 issue date ※ 08 October 2019|
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